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SMP-75 Case
10-Terminal Ceramic Surface-Mount Case
19 x 6.5 mm Nominal Footprint
Case Dimensions
Dimension
mm
Inches
Min
Nom
Max
Min
Nom
Max
A
B
C
18.80
6.30
19.00
6.50
1.75
19.30
6.80
2.00
0.740
0.248
0.748
0.256
0.069
0.760
0.268
0.079
D
E
H
P
2.29
1.02
1.0
1.905
0.090
0.040
0.039
0.075
Solder Pad
Termination
Lid
Body
Pb Free
Materials
Au plating 30 - 60 μinches (76.2-152 μm) over 80-200
μinches (203-508 μm) Ni.
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phos-
phorus) 100-200 μinches Thick
Al 2 O 3 Ceramic
Port 1
Port 2
Electrical Connections
Connection
Input or Return
Return or Input
Output or Return
Return or Output
Ground
Terminals
10
1
5
6
All others
Single Ended Operation
Differential Operation
Return is ground
Return is hot
B
C
H
D
P (8 Places)
6
7
5
4
5
4
6
7
A
8
3
3
8
9
10
2
1
2
1
9
10
E (10 Places)
TOP VIEW
www.RFM.com E-mail: info@rfm.com
?2009 by RF Monolithics, Inc.
BOTTOM VIEW
Page 4 of 5
SF1092A - 3/2/09
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